? e96526-te sony reserves the right to change products and specifications without prior notice. this information does not convey any license by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustrating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. high-frequency spdt antenna switch CXG1024N absolute maximum ratings (ta=25 ?) supply voltage v dd 8v control voltage vctl (h)?ctl (l) 8 v operating temperature topr ?5 to +85 ? storage temperature tstg ?5 to +150 ? input power pin (rf2, rf3, rf4) 37 dbm pin (rf1, rf5, rf6) 30 dbm description the CXG1024N is a high power antenna switch mmic to connect t x /r x to one of 4 antennas. this ic is designed using the sony? gaas j-fet process and operates at a single positive power supply. features single positive power supply operation low insertion loss 0.4 db (typ.) at 1.0 ghz (t x port) isolation 21 db (typ.) at 1.0 ghz (t x port) high power switching p1 db (typ.) 32 dbm at 1.5 ghz v ctl (h)=3.0 v 35 dbm at 1.5 ghz v ctl (h)=4.0 v applications antenna switch for digital cellular telephones structure gaas j-fet mmic 16 pin ssop (plastic) function block diagram diversity antenna 2 diversity antenna 1 antenna 2 antenna 1 t x r x
? CXG1024N pin configuration and recommended circuit rf1 ctlc v dd rf2 gnd ctlb rf3 gnd rf6 ctld gnd rf5 gnd ctla rf4 gnd 100pf 1 100pf 100pf 100pf 100pf 100k w 8 ctlb ctla ctld ctlc ctla ctlb 16 9 100pf 100pf 100pf 100pf 100pf 100k w 100pf logic table on-port rf3?f2 rf3?f4 rf5?f2 rf5?f4 rf5?f6 rf5?f1 ctla h l l h l l ctlb l h h l l l ctlc h or l h or l l l l h ctld h or l h or l l l h l recommended operating conditions item control voltage (high) control voltage (low) difference of control voltage supply voltage symbol vctl (h) vctl (l) vctl (h)?ctl (l) v dd min. ? vctl (h)?.6 typ. vctl (h)?.5 max. 6 6 vctl (h)?.4
? CXG1024N electrical characteristics (ta=25 ?) insertion loss isolation vswr 1 db compression power switching time control current supply current symbol il. iso. vs. p1 db t sw ictl i dd signal passes rf3?f2 rf3?f4 rf5?f2 rf5?f4 rf5?f1 rf5?f6 rf3?f2 rf3?f4 rf5?f2 rf5?f4 rf5?f1 rf5?f6 rf3?f2 rf3?f4 rf5?f2 rf5?f4 rf5?f1 rf5?f6 rf3?f2 rf3?f4 rf5?f2 rf5?f4 rf5?f1 rf5?f6 test condition * 2 pin=30 dbm * 2 pin=20 dbm * 2 pin=20 dbm * 2 pin=20 dbm * 2 pin=30 dbm * 2 pin=20 dbm * 2 pin=30 dbm * 2 pin=20 dbm * 3 * 2 * 1 * 3 * 2 * 1 * 2 * 2 frequency 1 ghz 1.5 ghz 2 ghz 1 ghz 1.5 ghz 2 ghz 1 ghz 1.5 ghz 2 ghz 1 ghz 1.5 ghz 2 ghz 1 ghz 1.5 ghz 2 ghz 1 ghz 1.5 ghz 2 ghz 0.1 to 2 ghz 0.1 to 2 ghz 1.5 ghz 1.5 ghz 1.5 ghz 1.5 ghz 1.5 ghz 1.5 ghz 0.1 to 2 ghz min. typ. max. unit 0.4 0.65 0.5 0.8 0.7 1.0 0.5 0.8 0.65 0.95 0.9 1.2 db 0.6 0.9 0.75 1.05 1.2 1.5 0.4 0.7 0.5 0.8 0.7 1.0 18 21 15 18 12 15 db 21 24 17 20 15 18 1.3 1.5 1.3 1.5 30 32 33 35 35 37 dbm 22 24 25 27 27 29 200 nsec ? 100 ? 100 * 1 : vctl (h)=5 v, vctl (l)=0 v, v dd =4.5 v * 3 : vctl (h)=3 v, vctl (l)=0 v, v dd =2.5 v * 2 : vctl (h)=4 v, vctl (l)=0 v, v dd =3.5 v
? CXG1024N 0 0.4 0.8 1.2 0 0.6 1.2 1.8 2.4 3 ?0 ?0 ?0 0 0.3 0.9 1.5 2.1 2.7 ?0 1.6 0 0.4 0.8 1.2 0 0.6 1.2 1.8 2.4 3 ?0 ?0 ?0 0 0.3 0.9 1.5 2.1 2.7 ?0 1.6 insertion loss and isolation vs. frequency (rf3?f2, rf3?f4) insertion loss isolation frequency [ghz] insertion loss [db] isolation [db] insertion loss [db] isolation [db] frequency [ghz] insertion loss isolation insertion loss and isolation vs. frequency (rf5?f2, rf5?f4)
? CXG1024N 0 0.4 0.8 1.2 0 0.6 1.2 1.8 2.4 3 ?0 ?0 ?0 0 0.3 0.9 1.5 2.1 2.7 ?0 1.6 insertion loss and isolation vs. frequency (rf5?f1, rf5?f6) insertion loss isolation frequency [ghz] insertion loss [db] isolation [db]
CXG1024N ? 16pin ssop (plastic) sony code eiaj code jedec code package structure package material lead treatment lead material package weight epoxy resin solder / palladium copper / 42 alloy 0.1g ssop-16p-l01 ssop016-p-0044 * 5.0 0.1 0.65 0.12 0.22 ?0.05 + 0.1 8 1 9 16 * 4.4 0.1 6.4 0.2 0.1 0.1 0.5 0.2 0?to 10 0.15 ?0.02 + 0.05 1.25 ?0.1 + 0.2 a detail a 0.1 plating note: dimension * ?does not include mold protrusion. package outline unit : mm
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